Summary
INTERCONNECT STRATEGIES
See the full content of this document
Extract
PCB stackup analysis and design, Part 2: Stackup analysis can help to optimize layer count, trace width and spacing and electrical performance.
WHEN DESIGNING a PCB stackup, it is essential to consider crosstalk (1) requirements. Depicted by FIGURE 4 are two single-ended traces having line width W, thickness t, edge-to-edge separation Sn and height over reference plane H. Er is the relative dielectric constant of the substrate.
In order to minimize crosstalk, it is desirable to set H as small and Sn as large as allowed by board target impedance and routing restrictions. (14) The effect of these stackup param...See the full content of this document
Sponsored links
