Summary
SOLDER MATERIALS
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Present and future solder technologies: how new powders, activator chemistries and epoxy fluxes are evolving for production use.
History shows that the electronics assembly industry is always up for a good challenge. This was proved with the successful move from through-hole to SMT assembly, the elimination of CFCs from the cleaning process and implementation of Pb-free, to name just a few. Now, the industry is arguably at one of its biggest--er, smallest--challenges to date: extreme miniaturization. Although device footprint reduction has been an ongoing process over the past two decades, recent developments are some of the most exigent to date. Although designing much smaller package...
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